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DPP-270L Sauce Blister Packing Machine

dpp-270l blister machine honey
blister sample
various pump
change molds
strict inspection
dpp-270l blister machine honey
blister sample
various pump
change molds
strict inspection

DPP-270L Sauce Blister Packing Machine

DPP-270L sauce blister packing machine is designed to pack liquid products (such as syrups, oils, or creams) into individual blister packs.

Heating and Molding: The film is heated to a specific temperature to make it soft and pliable. It then passes into a forming station where it is molded into individual pockets (blisters) using a set of molds. A vacuum or air pressure is used to help shape the film into cavities that will hold the liquid product.

Dosing Mechanism:This can include a pump, nozzle, or volumetric system to ensure accurate filling of the correct amount of liquid into each blister.

Sealing Process: The filled blister packs are passed through a sealing station where heat and pressure are applied to bond the lidding film to the base film. This creates a sealed pocket, protecting the liquid product from contamination, leakage, or spoilage.

Cięcie: Po zapieczętowaniu, the machine cuts the continuous strip of blisters into individual packs.

Specyfikacja:

Aż do 9600 plates/h

Applicable for perfume, jam, honey

Nadaje się do PVC、Ps、Materiał dla zwierząt domowych

How is the honey blister packing work?

Liquid blister packing machine works by forming blisters, filling them with liquid, sealing them with a lidding film, and ensuring quality control through automated processes.

Główne funkcje

Production capacity9 9,600 Blistry/h
Maksymalny obszar formowania i głębokość 255*125*15MM Max Głębokość wynosi 26 mm (wykonane niestandardowe)
Całkowita moc 7.0kW
Wskaźnik szumu <72dba

Ketchup Blister Packing Machine Advantage

Ketchup blister machine is driven by full servo, the traction distance is zero error, and the maximum traction distance can reach 185mm.

DPP-270L blister packing machine programmed all the data, PLC control, frequency control, speed control, touch screen operation, higher accuracy.

All the moulds were positioned by high-grade slot clamping type, one-key positioning, and the debugging time was reduced by half.

Główne części

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